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SAN-EI KAGAKU CO., LTD.

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Via Fill Pastes from San-ei Kagaku

 

Meet the Most Demanding Requirements

 

Minimal Z-Axis expansion under stress allows intricate build-up designs

Excellent paste hardness after cure enables flat
pads after sanding

  • Packaged in 1Kg containers or in 0.5 Kg tubes.

  • Tubes are compatible with standard automated via filling machines

  • Packaging of paste is void-free in the tubes; excellent no-void filling results

  • Improved pot  life at room temperature of up to 7 days

  • Pastes with High Tg and Low CTE above Tg (see data on reverse side)

  • Excellent flow through high aspect ratio holes

  • No chemical attack during desmearing

  • NASA outgas compliant pastes

  • Halogen free and RoHS Compliant

  • UL V-0 approved                                                                

 

 

 

San-ei Kagaku PHP-900 Series

 

Property

 

Unit/Condition

IR-6P

IR-10FE

Viscosity

 

Pa.s/25°C

35±5*

40±5*

Shelf Life

 

≤5°C

3 months

3 months

Pot Life

 

25°C

7 days

7 days

Tg (TMA)

 

°C

168

158

CTE

β1

ppm/°C

39

38

 

β2

ppm/°C

105

89

Young’s Modulus (DMA)

30°C

M Pa

5200

8060

 

100°C

 

4300

6030

 

150°C

 

2600

4030

 

200°C

 

870

2110

 

250°C

 

660

1620

Water Absorption

JIS C6481

%

0.16

0.18

Filler Size

Avg.

µm

2-3

2-3

 

Max.

 

15.0

15.0

Solids

 

%

100

100

Outgas Testing (ASTM E 595)

TML

%

0.38

0.26

 

CVCM

%

0.062

0.003

 

WVR

%

0.23

0.17

Halogen Free

 

 

Yes

Yes

UL Approval

 

 

94V-0

94V-0

Cu Peel Strength

 

kg/cm

0.67

0.89

Cure Profile
(surface temperature)

 

°C x minutes

140x20

110x60
+ 150x30

 

 

 

 

 


Very Notable Features:

 

Very fast process cycle time possible with IR-6P (20-minute cure)
 

 Best in class overall end-user performance with IR-10F products

  •  Very high Cu peel strength

  •  Low CTE above Tg

  •  Very tough performance at elevated temperatures as noted in the Young’s Modulus data

 
    
  

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