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Indubond 130 N - Inductive Bonding Machine 
| High technology Indubond Pin Registration Machine- Inductive points to maintain the registration
- High-precision registration with mechanical pins;
- Elastic bonding points that withstand the movements of the inner layers during the hot press cycle;
- Is assures the linear movements of the multilayer stack caused by thermal dilatations;
- It eliminates the internal tensions of the multilayer stack thereby reducing the warping effects;
- Constant and precise thickness over the entire surface area. The flat bonding points allow maximum and uniform pressure during the pressing cycle;
- Guarantee press plates Long life, the flat inductive bonding points, avoid damage on the press plates
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| all4-PCB (North America) Inc. 345 Mira Loma Avenue Glendale, CA 91204 USA Copyright© - 2003 - All rights reserved. |