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 Indubond 130 N - Inductive Bonding Machine

 

High technology Indubond Pin Registration Machine
  • Inductive points to maintain the registration
  • High-precision registration with mechanical pins;
  • Elastic bonding points that withstand the movements of the inner layers during the hot press cycle;
  • Is assures the linear movements of the multilayer stack caused by thermal dilatations;
  • It eliminates the internal tensions of the multilayer stack thereby reducing the warping effects;
  • Constant and precise thickness over the entire surface area. The flat bonding points allow maximum and uniform pressure during the pressing cycle;
  • Guarantee press plates Long life, the flat inductive bonding points, avoid damage on the press plates

 
  
    
  

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all4-PCB (North America) Inc.
345 Mira Loma Avenue
Glendale, CA 91204 USA
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