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Solder Mask Process Equipment
| Spray Coating Lines, Modular System - line configuration adapted according your specific production requirement
- high availability, constant reproducible process parameters, fast change of products (different colors), easy fast cleaning, lacquer recycling system
- capacity: 1-4 boards per min ds, depending on board length
- substrate thickness 0,8 – 10mm (31 - 400mil)
- width x length various, minimum 300 x 300 (12 x 12") / maximum 760 x 1500mm (30 x 60"), uncoated edges prevent the transport systems against dirt
| | | Spray Coater Module KU-453 | 
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Expandable with several options
lacquer feeding station for conditioned products
second spray gun for fast product change gap reduction unit for zero gap coating of
incoming substrates cleaning unit for spray chamber parts capacity: approx. 4 boards per min ds,
depending on board length and drying systems
substrate thickness 0,8 – 10mm (31 - 400mil) width x length various, minimum 300 x 300 (12 x 12") / maximum 760 x 1500mm (30 x 60"),
uncoated edges prevent the transport systems
against dirt
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Box-buffer spray coating module KU-680
capacity: >1 substrate per min, double sided
max. 20 substrates identical width and length
substrate thickness 0,8 – 10mm (31 - 400mil)
width x length various, minimum 300 x 300 (12 x 12") / maximum 610 x 610mm (24 x 24"), uncoated
edges prevent the transport systems against dirt
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 | Optional Lacquer Feeding StationAligned for the specific need of the applied products:
· with one lacquer pot and filter system
· solvent container and autom. viscosity control unit
· stirrer unit any time expandable with heat-/cooling unit Advantage with lacquer feeding station:
· lacquer recycling = reduced lacquer consumption
· reproducible process conditions fast lacquer change
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