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Globally
Connected
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Click on the logo for more
info |
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Conductive Copper Paste for Via Filling
"DD Paste AE 3030" |
Features________________________________________________________________ |
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- Conductive paste for plating via filing
- TG 171C
- Thermal Conductivity 7.8W/mK
- Excellent adhesion between top plating and AE
3030
- Void less
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Structure_________________________________________________________________________ |
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Characteristics____________________________________________________________________ |
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Filler |
Silver coationg copper powder |
Resistivity |
3X10-4Ω cm |
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Binder |
Epoxy resin
(one packed type) |
Tg (Glass
transition temp.) |
171șC(DMA) |
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Solvent |
Non |
Linear thermal expansion coefficient |
α1 |
4.0X10-5/șC |
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Density (25șC) |
4.2g/cm3 |
α2 |
8.6X10-5/șC |
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Thixotropy
index |
4.0 (2/20rpm) |
Thermal
conductivity |
7.8 W/mK |
Viscosity
(25șC) |
BH type
viscometer |
1500dPa s |
Modulus of
elastisity |
1.5X1010 Pa |
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Curing condition |
Pre heat |
60șC/60min |
Peel strength
(Non roughening) |
5.0 N/cm |
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Post cure |
160șC/60min |
Water
absorption (100șC/60min) |
0.08 wt% |
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Call toll free
at 1
(866) 734 9403
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all4-PCB (North
America) Inc.
4218 San Fernando Road
Glendale, CA 91204 USA
Copyright© - 2003 - All rights reserved. |