PCB Equipment

Hand Tool for Via Hole Filling
	Double click the picture to the left to download a short video on this unit Hand-held via-plugging unit for: - Evaluation of different plugging inks - Filling of regional features, such as BGAs Compatible with Silver Pastes, Cu Pastes & Non-conductive epoxy pastes Excess paste can be stored in refrigerator Printing head diameter 2.56” Paste forced by compressed air through the PCB vias
Vacuum Plugging Machine VCP100 & 200
	Double click the picture to the left to download a short video on this unit Panel is placed inside machine and vacuum is drawn inside the chamber to minimize air in the holes Utilizing a similar principle as the hand-held unit, compressed air is used to force the material into a designated head and then through the via holes Depending on factors, such as hole quality and paste rheology, holes up to 1:30 aspect ratio can be filled Controlled depth drilled blind vias can be filled Easy filling of barrel plated vias Excess material is removed by squeegee system
IR Cure Oven for Solder Mask & Legend Ink
	Cure Time less than 10 minutes Flat Conveyor System with following advantages: - No panel warpage - Easy transport of thin panels - No marking on solder mask surface (mask is procured from exposure step) IR Heat from the top Convection heat across the transport direction to distribute hot air evenly and remove volatiles Aluminum plate heating under the conveyor Modular system